MLSP-L19: Multimodal and Contrastive Representation Learning
Oral
Thu, 7 May, 09:00 - 11:00
Location: Room 113
Session Type: Oral
Track: Machine Learning for Signal Processing [ML]
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Thu, 7 May, 09:00 - 09:20

MLSP-L19.1: EMPOWERING THE TAIL: ADAPTIVE SEMANTIC NEIGHBORHOOD ENHANCEMENT FOR LONG-TAIL REASONING IN TEMPORAL KNOWLEDGE GRAPHS
Yi Yang, Bin Chen, Zhangtao Cheng, Kaiju Li, Jia Chen, Ting Zhong, Fan Zhou, University of Electronic Science and Technology of China, China
Thu, 7 May, 09:20 - 09:40

MLSP-L19.2: STDIFFUSION: A SPATIOTEMPORAL INTERPOLATION-ORIENTED DIFFUSION MODEL FOR SIGNAL SERIES LATENT REPRESENTATION GENERATION
Hao Xiong, School of Computer Science, Beijing University of Posts and Telecommunications, Bejing, China, China; Dan Luo, Fang Zhao, School of Artificial Intelligence, Beijing Forestry University, Beijing, China, China; Yang Gao, Institute of Computing Technology, Chinese Academy of Sciences, Bejing, China, China; Xuming yue, Jiayi Gong, School of Computer Science, Beijing University of Posts and Telecommunications, Bejing, China, China; Haiyong Luo, Institute of Computing Technology, Chinese Academy of Sciences, Bejing, China, China
Thu, 7 May, 09:40 - 10:00

MLSP-L19.3: EATS2 : ENABLING EFFICIENT AND ACCURATE TRAJECTORY SIMILARITY COMPUTATION VIA SELF-TRAINING
Zijian Cao, Yungeng Zhang, Yuan Chang, Xiaohou Shi, Yaqi Song, Yutong Wang, Mingchuan Yang, China Telecom Research Institute, China
Thu, 7 May, 10:00 - 10:20

MLSP-L19.4: LARGE VISION MODELS CAN SOLVE MENTAL ROTATION PROBLEMS
Sebastian Ray Mason, Anders Gjølbye, Phillip Chavarria Højbjerg, Lenka Tětková, Lars Kai Hansen, Technical University of Denmark, Denmark
Thu, 7 May, 10:20 - 10:40

MLSP-L19.5: FEATURE IDENTIFICATION FOR HIERARCHICAL CONTRASTIVE LEARNING
Julius Ott, Nastassia Vysotskaya, Huawei Sun, Infineon Technologies AG, Germany; Lorenzo Servadei, Robert Wille, Technical University of Munich, Germany
Thu, 7 May, 10:40 - 11:00

MLSP-L19.6: WAVLINK: COMPACT AUDIO–TEXT EMBEDDINGS WITH A GLOBAL WHISPER TOKEN
Gokul Karthik Kumar, Ludovick Lepauloux, Hakim Hacid, Technology Innovation Institute, United Arab Emirates