Yi-Chiao Wu, Dejan Markovic, Steven Krenn, Israel D. Gebru, Alexander Richard, Meta, United States of America

Youqiang Zheng, Weiping Tu, Li Xiao, Xinmeng Xu, Wuhan University, China

Chenglong Jiang, Ying Gao, Hao Jin, Linrong Pan, W. Y. Ng Wing, South China University of Technology, China

Jae-Won Kim, Kwangwoon University, Korea, Republic of; Byeongho Jo, Seungkwon Beack, Electronics and Telecommunications Research Institute, Korea, Republic of; Hochong Park, Kwangwoon University, Korea, Republic of

Youqiang Zheng, Weiping Tu, Li Xiao, Xinmeng Xu, Wuhan University, China

Liang Xu, Jing Wang, Jianqian Zhang, Xiang Xie, Beijing Institute of Technology, China

Mahmoud Namazi, Kenneth Rose, University of California, Santa Barbara, United States of America

Haici Yang, Indiana University, United States of America; Inseon Jang, Electronics and Telecommunications Research Institute, Korea, Republic of; Minje Kim, University of Illinois at Urbana-Champaign, United States of America

Christoph Hold, Ville Pulkki, Aalto University, Finland; Archontis Politis, Tampere University, Finland; Leo McCormack, Aalto University, Finland

Nils Marggraf-Turley, University of Surrey, United Kingdom of Great Britain and Northern Ireland; Michael Lovedee-Turner, Fraunhofer Institute for Integrated Circuits, Germany; Enzo De Sena, University of Surrey, United Kingdom of Great Britain and Northern Ireland

Harshvardhan Takawale, Nirupam Roy, University of Maryland, College Park, United States of America

Huiyuan Sun, The University of Sydney, Australia; Howe Y. Zhu, Minh T. D. Nguyen, Vincent Nguyen, Chin-Teng Lin, University of Technology Sydney, Australia; Craig T. Jin, The University of Sydney, Australia