B4.1: mm-Wave UWB Tightly Coupled Dipole Array Realized Using a Hybrid PCB – 3D Printing Fabrication Approach
Michail Anastasiadis, FIU, United States; Md Rakibul Islam, Galtronics USA Ltd., United States; Jorge Caripidis Troccola, John Volakis, FIU, United States
B4.3: MIMO WiFi Imaging based on Reconfigurable Passive EM Skins
Joseph Faia, Danilo Erricolo, University of Illinois Chicago, United States; Giacomo Oliveri, ELEDIA Research Center University of Trento, Italy
B4.4: Wideband Analog Interference Cancellation Using True Time Delays, Hadamard Projections, and a Kronecker Decomposition Algorithm
Devon Ward, Student at Brigham Young University, United States; Karl Warnick, Brigham Young University, United States