Liang Liu, Zhouchen Li, University of Electronic Science and Technology of China, China; Jiancheng An, Singapore University of Technology and Design, Singapore; Lu Gan, University of Electronic Science and Technology of China, China; Hongbin Li, Stevens Institute of Technology, United States of America

Zongyu Wang, Yuhan Li, Yihan Su, Tsinghua University, China; Tianyao Huang, University of Science and Technology Beijing, China; Yimin Liu, Tsinghua University, China

Jilu Jin, Xueqin Luo, Northwestern Polytechnical University, China; Gongping Huang, Wuhan University, China; Jingdong Chen, Northwestern Polytechnical University, China; Jacob Benesty, University of Quebec, China

Ching-Hua Lee, Samsung Research America, United States of America; Kashyap Patel, The University of Texas at Dallas, United States of America; Chouchang Yang, Yilin Shen, Hongxia Jin, Samsung Research America, United States of America

Weijie Chen, Yaling Deng, Chongtao Guo, Yuan Ma, Bin Liao, Shenzhen University, China

Umesh Sharma, The LNM Institute of Information Technology Jaipur, Rajasthan, India, India; Monika Agrawal, Indian Institute of Technology Delhi, India, India

Tianyi Liu, Technical University of Darmstadt, Germany; Sai Pavan Deram, IMDEA Networks, Spain; Khaled Ardah, Lenovo, Germany; Martin Haardt, Ilmenau University of Technology, Germany; Marc E. Pfetsch, Marius Pesavento, Technical University of Darmstadt, Germany

Jinyi Yang, Lin Chen, Xue Jiang, Shanghai Jiao Tong University, China; Wei Liu, University of Sheffield, United Kingdom of Great Britain and Northern Ireland

Ruiwa Sun, Congwei Feng, Huawei Chen, Nanjing University of Aeronautics and Astronautics, China

Chengyuan He, Chengwei Zhou, Zhiguo Shi, Jiming Chen, Zhejiang University, China

Hongqing Yu, Ziyi Wang, Heng Qiao, Shanghai Jiao Tong University, China