Feng Cao, Chang Liu, Deyu Li, Yuhua Qian, Chao Zhang, Hu Zhang, Shanxi University, China, China

Taewoong Kang, Korea University, Korea, Republic of; Jeongsik Oh, Jaeseong Lee, Sunghyun Park, Jaegul Choo, Korea Advanced Institute of Science & Technology, Korea, Republic of

Ming Fang, Xinning Du, Qi Liu, Yunpeng Zhou, Qiwen Liang, Shuhua Liu, Northeast Normal University, China

Kyoungoh Lee, Kwang-Ju Kim, Pyong-Kun Kim, In-su Jang, Electronics and Telecommunications Research Institute (ETRI), Korea, Republic of

Leonardo Rossi, Vittorio Bernuzzi, Tomaso Fontanini, Massimo Bertozzi, Andrea Prati, University of Parma, Italy

Minglang Qiao, Mai Xu, Shijie Wen, Lai Jiang, Shengxi Li, Tao Xu, Beihang University, China; Yunjin Chen, Alibaba Group, China; Leonid Sigal, University of British Columbia, Canada

LIJUN WANG, University of Science and Technology of China, China

Jun-Jie Huang, Tianrui Liu, Jingyuan Xia, National University of Defense Technology, China; Meng Wang, Hefei University of Technology, China; Pier Luigi Dragotti, Imperial College London, United Kingdom of Great Britain and Northern Ireland

Sota Miyamoto, Tokyo Institute of Technology, Japan; Takuma Yagi, National Institute of Advanced Industrial Science and Technology (AIST), Japan; Yuto Makimoto, Mahiro Ukai, Tokyo Institute of Technology, Japan; Yoshitaka Ushiku, Atsushi Hashimoto, OMRON SINIC X Corporation, Japan; Nakamasa Inoue, Tokyo Institute of Technology, Japan

Yunling Feng, Yang Lei, Xinjie Yang, Jian Xu, Xingxian Liu, Bo Xiao, Yajing Xu, Beijing University of Posts and Telecommunications, China

Zixuan Sun, Huihui Song, Kaihua Zhang, Nanjing University of Information Science and Technology, China; Gang Dong, Lingyan Liang, Yaqian Zhao, Inspur Electronic Information Industry Co., Ltd., Beijing, China, China

Yajun Jian, Chihui Zhuang, Wenyan He, Kaiwen Du, Yang Lu, Hanzi Wang, Xiamen University, China