Ya-Wei Eileen Lin, Technion - Israel Institute of Technology, Israel; Yuval Kluger, Yale University, United States of America; Ronen Talmon, Technion - Israel Institute of Technology, Israel

Meng Xu, University of Chinese Academy of Sciences, China; Bo Jiang, Nanjing Normal University, China; Wenqiang Pu, The Chinese University of Hong Kong, China; Ya-Feng Liu, Chinese Academy of Sciences, China; Anthony Man-Cho So, The Chinese University of Hong Kong, China

Lincon Souza, Takumi Kobayashi, Yasunori Nishimori, Yasuko Sugase-Miyamoto, Kenji Kawano, Shotaro Akaho, Narihisa Matsumoto, National Institute of Advanced Industrial Science and Technology (AIST), Japan

Mete Ozay, Samsung Research UK, United Kingdom of Great Britain and Northern Ireland

Hao Sun, Junting Chen, Yuan Luo, The Chinese University of HongKong, Shenzhen, China

Trung Thanh Le, Karim Abed-Meraim, Philippe Ravier, Olivier Buttelli, University of Orleans, France; Ales Holobar, University of Maribor, Slovenia

Trung Thanh Le, Karim Abed-Meraim, Philippe Ravier, Olivier Buttelli, University of Orleans, France; Ales Holobar, University of Maribor, Slovenia

Xin-Tong Liu, Xiao-Feng Gong, Dong Zhao, Qiu-Hua Lin, Dalian University of Technology, China

Jiani Liu, Ce Zhu, Yang Chen, University of Electronic Science and Technology of China, China; XiaoLin Huang, Shanghai Jiao Tong University, China; Yipeng Liu, University of Electronic Science and Technology of China, China

Li Ge, Xue Jiang, Lin Chen, Xingzhao Liu, Shanghai Jiaotong University, China; Martin Haardt, Ilmenau University of Technology, China

Guo-Zhao Liao, Xiao-Feng Gong, Qiu-Hua Lin, School of Information and Communication Engineering, Dalian University of Technology, China., China

Mert Indibi, Selin Aviyente, Michigan State University, United States of America