Bo Yang, Japan; Konosuke Temmei, NEC Corporation; Shinji Takamune, Rui Sugeta, Miho Hashimoto, Akinori Kuriyama, Kengou Higashi, Toshiharu Sassa, Hideyuki Tanaka, Sumihiro Shirai, Hidehisa Soejima, Koichi Nakao, Saiseikai Kumamoto Hospital; Shuhei Noyori, Junko Watanabe, Mieko Shimizu, Keiichirou Okamoto, Masahiro Kubo, NEC Corporation

Kyungjin Kim, Seoul National University; Arpit Mathur, Adam Perer, Carnegie Mellon University; Jongmo Seo, Seoul National University

Sasa Kendjel, Eda Jovicic, Alan Jovic, University of Zagreb Faculty of Electrical Engineering and Computing

Juncheng Yu, Lusi A, Haoxuan Xie, Weiming Wang, Tsinghua University

Alexandre Buisson, Paul Dumont, Lucia Cevidanes, Juan Carlos Prieto, University of North Carolina, Chapel Hill, NC ,USA; Aron Aliaga, University of Michigan, Ann Arbor, MI, USA; Jonas Bianchi, University of the Pacific, San Francisco, CA, USA; Rodrigo Texeira, University of Michigan, Ann Arbor, MI, USA; Steve Pieper, Isomics Incorporation, Cambridge, MA, USA; Tengfei Li, Hongtu Zhu, University of North Carolina, Chapel Hill, NC ,USA; Claudia Mattos, University of Michigan, Ann Arbor, MI, USA

Ruiheng Yu, James Bray, University of Houston; Yunqi Liu, University of Toronto; Xinyu Qin, Lu Wang, university of Houston