Jingbo Miao, Kan Wang, University of Chinese Academy of Sciences, China; Yanwei Liu, Zhen Xu, Chinese Academy of Sciences, China; Jinxia Liu, Zhejiang Wanli University, China

Guanxing Zhou, Yihong Zhuang, Xinghao Ding, Yue Huang, Xiaotong Tu, Xiamen University, China; Saqlain Abbas, Department of Mechanical Engineering, University of Engineering and Technology(UET)Lahore( Narowal campus), Pakistan

Seyyid Emre Sofuoglu, Meta Platforms Inc., United States of America; Selin Aviyente, Michigan State University, United States of America

Wenbin Yang, Zijia Wang, Jiacheng Ni, Qiang Chen, Zhen Jia, Dell Technologies, China

Azim Ahmadzadeh, Rafal A. Angryk, Georgia State University, United States of America

Huasen Wang, Lingling Gao, Qianchao Tan, Luping Ji, University of Electronic Science and Technology of China, China

Keisuke Maeda, Takahiro Ogawa, Miki Haseyama, Hokkaido University, Japan

Zichuan Chen, Washington University in St.Louis, United States of America; Peng Liu, Singapore Management University, Singapore

Yuanhao Gong, Shenzhen University, China

Zhengguo Li, Jinghong Zheng, J Senthilnath, Institute for Infocomm Research, A*Star, Singapore

Teng Ren, Haitao Zhang, Beijing University of Posts and Telecommunications, China

Yiming Ma, Victor Sanchez, University of Warwick, United Kingdom of Great Britain and Northern Ireland; Tanaya Guha, University of Glasgow, United Kingdom of Great Britain and Northern Ireland

Andreas Goerlitz, Michael Moeller, Andreas Kolb, University of Siegen, Germany

Yuto Sumiya, Tomoki Otsuka, Yoshihiro Maeda, Norishige Fukushima, Nagoya Institute of Technology, Japan