Sen Ho Choi, Isaac Fung Chap, Huicheng Zhang, Yulun Wu, Yueqiao Zhang, Hao Shen, Huu Quyen Dang, Zhili Tan, Simon Lui, Huawei Technologies Co., Ltd., China; Qiuqiang Kong, The Chinese University of Hong Kong, Hong Kong; Yaolong Ju, Great Bay University, China

Simon Schwär, International Audio Laboratories Erlangen, Germany; Christian Dittmar, Fraunhofer Institute for Integrated Circuits IIS, Germany; Stefan Balke, Meinard Müller, International Audio Laboratories Erlangen, Germany

Xiaoyu Yi, Peking University, China; Qi He, Music X Lab, China; Gus Xia, Ziyu Wang, MBZUAI, United Arab Emirates

Abhiram Gorle, Connor Ding, Sagnik Bhattacharya, Stanford University, United States of America; Amit Kumar Singh Yadav, Purdue University, United States of America; Tsachy Weissman, Stanford University, United States of America

Shuyang Cui, Zhi Zhong, Qiyu Wu, Zachary Novack, Sony Group Corporation, Japan; Woosung Choi, Sony AI, Japan; Keisuke Toyama, Sony Group Corporation, Japan; Kin Wai Cheuk, Junghyun Koo, Yukara Ikemiya, Sony AI, Japan; Christian Simon, Chihiro Nagashima, Shusuke Takahashi, Sony Group Corporation, Japan

Junan Zhang, Yunjia Zhang, Xueyao Zhang, The Chinese University of Hong Kong, Shenzhen, Hong Kong; Zhizheng Wu, The Chinese University of Hong Kong, Shenzhen, City University of Macau, Shenzhen Loop Area Institute, Amphion Technology Co., Ltd., Hong Kong

Abhinaba Roy, Geeta Puri, Dorien Herremans, Singapore University of Technology and Design, Singapore

Lekai Qian, Haoyu Gu, Dehan Li, Boyu Cao, Qi Liu, South China University of Technology, China

Ting-Kang Wang, Chih-Pin Tan, Yi-Hsuan Yang, National Taiwan University, Taiwan

Jongmin Jung, Dongmin Kim, Sihun Lee, Seola Cho, Sogang University, Korea, Republic of; Hyungjoon Soh, Seoul National University, Korea, Republic of; Irmak Bukey, Chris Donahue, Carnegie Mellon University, United States of America; Dasaem Jeong, Sogang University, Korea, Republic of