Genshun Wan, Lijuan Liu, University of Science and Technology of China, China, China; Changfeng Xi, iFlytek Research, China, China; Hang Chen, University of Science and Technology of China, China, China; Xindi Yu, Jia Pan, iFlytek Research, China, China; Jun Du, Zhongfu Ye, University of Science and Technology of China, China, China

Alexander Polok, Dominik Klement, Brno University of Technology, Czechia; Samuele Cornell, Carnegie Mellon University, United States of America; Matthew Wiesner, Johns Hopkins University, United States of America; Jan Černocký, Brno University of Technology, Czechia; Sanjeev Khudanpur, Johns Hopkins University, United States of America; Lukáš Burget, Brno University of Technology, Czechia

Martin Kocour, Filevine, United States of America; Martin Karafiát, Alexander Polok, Dominik Klement, Lukáš Burget, Jan Černocký, Brno University of Technology, Czechia

Muhammad Shakeel, Yosuke Fukumoto, Chikara Maeda, Honda Research Institute Japan Co.,Ltd., Japan; Chyi-Jiunn Lin, Shinji Watanabe, Carnegie Mellon University, USA, Japan

Xiluo He, Johns Hopkins University, United States of America; Alexander Polok, Brno University of Technology, Czechia; Jesus Villalba, Thomas Thebaud, Matthew Maciejewski, Johns Hopkins University, United States of America

Minsoo Kim, SangHun Kim, Electronics and Telecommunications Research Institute, Korea, Republic of