Kanami Imamura, The University of Tokyo / National Institute of Advanced Industrial Science and Technology (AIST), Japan; Tomohiko Nakamura, National Institute of Advanced Industrial Science and Technology (AIST), Japan; Kohei Yatabe, Tokyo University of Agriculture and Technology, Japan; Hiroshi Saruwatari, The University of Tokyo, Japan

Changda Chen, Waseda University, Japan; Yichen Yang, Northwestern Polytechnical University, China; Wei Liu, Wuhan University, China; Shoji Makino, Waseda University, Japan

Naisong Zhou, École polytechnique fédérale de Lausanne, Switzerland; Saisamarth Rajesh Phaye, Milos Cernak, Andy Pearce, Tijana Stojkovic, Logitech, Singapore; Andrea Cavallaro, École polytechnique fédérale de Lausanne, Switzerland; Andrew Harper, Logitech, United Kingdom of Great Britain and Northern Ireland

Tsun-An Hsieh, University of Illinois Urbana-Champaign, United States of America; Sebastian Braun, Microsoft, United States of America

Woongjib Choi, Sangmin Lee, Hyungseob Lim, Hong-Goo Kang, Yonsei University, Korea, Republic of

Mingchi Hou, Idiap Research Institute, Switzerland; Ante Jukic, NVIDIA, United States of America; Ina Kodrasi, Idiap Research Institute, Switzerland

Binh Thien Nguyen, Masahiro Yasuda, Daiki Takeuchi, Daisuke Niizumi, Noboru Harada, NTT, Inc., Japan

Wei Liu, Wuhan University, China; Xueqin Luo, Jilu Jin, Northwestern Polytechnical University, China; Gongping Huang, Wuhan University, China; Jingdong Chen, Northwestern Polytechnical University, China; Jacob Benesty, University of Quebec, Canada; Shoji Makino, Waseda University, Japan

Carlos Hernández Oliván, Hendrik Vincent Koops, Hao Hao Tan, Elio Quinton, Universal Music Group, United Kingdom of Great Britain and Northern Ireland

Shuai Tao, Aalborg University, China