Tai Qin, School of Electronic and Computer Engineering, Shenzhen Graduate School, Peking University, China; Chunyang Fu, City University of Hong Kong, China; Yuxin Zhan, School of Electronic and Computer Engineering, Shenzhen Graduate School, Peking University, China; Shan Liu, Tencent Media Laboratory, China; Ge Li, School of Electronic and Computer Engineering, Shenzhen Graduate School, Peking University, China

Hoang Nhat Tran, Université Paris-Saclay, CNRS, CentraleSup´elec, L2S 91190 Gif-sur-Yvette, France, France; Francesco Di Sario, University of Turin, Italy, Italy; Gabriele Spadaro, LTCI, Telecom Paris, Institut Polytechnique de Paris, France; Giuseppe Valenzise, Université Paris-Saclay, CNRS, CentraleSup´elec, L2S 91190 Gif-sur-Yvette, France, France; Enzo Tartaglione, LTCI, Telecom Paris, Institut Polytechnique de Paris, France

Yuning Huang, Purdue University, United States of America; Jiahao Pang, InterDigital, United States of America; Fengqing Zhu, Purdue University, United States of America; Dong Tian, InterDigital, United States of America

Tianang Chen, Jian Jin, Shilv Cai, Zhuangzi Li, Weisi Lin, Nanyang Technological University, Singapore

Xudong Jin, Yoshitaka Kidani, KDDI Research, Inc, Japan

Ronghuang Ou, Lixuan Meng, Qi Zhang, Hailong Jiao, Wei Gao, Ge Li, Peking University, China