Tue, 9 Jul, 12:10 - 12:30
TU2.R3.3: Thermal-Aware Channel with Multiple Wires
Yeow Meng Chee, National University of Singapore, Singapore; Tuvi Etzion, Technion-Israel Institute of Technology, Israel; Schouhamer Immink Kees, Turing Machines Inc, Netherlands; Tuan Thanh Nguyen, Singapore University of Technology and Design, Singapore; Van Khu Vu, National University of Singapore, Singapore; Jos H. Weber, Delft University of Technology, Netherlands; Eitan Yaakobi, Technion-Israel Institute of Technology, Israel